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| Electronics Manufacturing Capability | |||||
| HERMETIC | PHOTONIC PACKAGES | ||||
| MULTI-CHIP MODULES (MCM) | ELECTRONIC MANUFACTURING | ||||
| PLASTIC ENCAPSULATED (PDIP, PPGA, PLCC, SOIC, SSOP) | WAFER CUTTING | ||||
| PLASTIC QUAD FLAT PACK (PQFP, TQFP) | ELECTRICAL TEST CAPABILITIES | ||||
| BALL GRID ARRAY (BGA) | RELIABILITY TEST CAPABILITIES (PLASTICS) | ||||
| QFN (QUAD FLAT NO LEADS) | RELIABILITY TEST-FIBER OPTICAL, TELCORDIA (BELL CORE) GR-63/1312/468-CORE | ||||
| CUSTOM PACKAGES CURRENTLY AVAILABLE | RELIABILITY TEST CAPABILITIES (MIL-STD-883) | ||||
PANTRONIX is a "Make it Happen" Organization dedicated to providing the right packaging solution in any situation. |
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PANTRONIX' customers include industry leaders in the Aerospace, Military and Commercial Business Sectors - Domestic and Foreign (Selected names upon request) |
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In addition to the capabilities listed herein, Pantronix is willing and able to explore the feasibility of other special packaging challenges. Call your Pantronix account reprasentative or the military programs director. |
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© 2008 Pantronix. All Rights Reserved. |
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