Pantronix Component Division provides a full range of cost effective custom package solutions.  Pantronix works closely with it’s customers to find the optimum cost-performance package structure for their specific applications.  We offer various forms of multi-chip module (MCM) technologies, multi-layer CQFP, hybrid packages, QFNs, and cavity packages.  We offer solutions for image sensors such as LCD sensors as well as bar-code readers.  Our cavity packages are designed for excellent performance for wireless RF applications.  If you have a circuitry requiring a customized package, we have the solution at Pantronix.