Pantronix Corporation - IC PAckaging, Electronic Manufacturing

Located in a 90,000 sq ft ISO 9001:2008 and ISO 13485:2003 Certified facility in Fremont California, Pantronix directly serves the aerospace, medical, military, communications, computer and consumer markets.

Pantronix Electronic Manufacturing Services include boards, modules, sub-assemblies, cables, harness, power supplies, box builds and complete systems and we use a wide range of technologies including Chip on Board (COB), Ball Grid Array (BGA), Surface Mount (SMT) and Through Hole (PTH).

Our operations are fully compliant with Mil-Std-883 Methods 5004 and 5005 with Certified Test Lab Facilities and we are on the Qualified Manufacturers List for 2nd party QML assembly per Mil-PRF-38535. For customers with mature programs we still conform to Mil-I-45208, Mil-Q-9858A and Mil-STD-45662.

Our fiber optic capabilities include optoelectronics component packaging, active module assembly, alignment and subsystem integration. Plus laser and optical assembly packaging for medical instrumentation; active component packages including die attach to fiber pigtailed/receptacle, coaxial or butterfly; active module packages transmitters,receivers, transceivers and transponders using Chip on Board, Multi Chip Modules and Flip Chip Technology.

Pantronix Corporation - SMT, PCB, SOLAR Assembly

PTX - Aerospace, Military, Electronics Manufacturing

Wafer back lapping & wafer saw (up to 12 inch wafers), packaging assembly, system integration, electrical test, optical test and turnkey solutions.

In addition we can provide device characterizations and system level testing including all relevant optical and electrical key parameters and we meet all the requirements of Telcordia (Bellcore) standards for environmental and Material tests on components and sub systems.

Pantronix Corporation
2710 Lakeview Court
Fremont, CA 94538
510-656-5898 • 510-656-7779