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Pantronix Corporation, since 1974 has been the U.S. leader in providing custom packaging & testing, as well as electronic manufacturing services to global customers in a wide range of industries. |
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Our operations are fully compliant with Mil-Std-883 Methods 5004 and 5005 with Certified Test Lab Facilities and we
are on the Qualified Manufacturers List for 2nd party QML assembly per Mil-PRF-38535 and Mil-PRF-38534. For customers with mature programs we still conform to Mil-I-45208, Mil-Q-9858A and Mil-STD-45662. |
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Located in a 90,000 sq ft ISO 9001:2000 certified facility in Fremont California, Pantronix directly serves the aerospace, medical, military, communications, computer and consumer markets. In addition, we partner with Amertron Inc. in the Philippines (2 plants) and Kun Shan, China for our customers who want low cost, high volume manufacturing services. |
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Our fiber optic capabilities include optoelectronics component packaging, active module assembly, alignment and subsystem integration. Plus laser and optical assembly packaging for medical instrumentation; active component packages including die attach to fiber pigtailed/receptacle, coaxial or butterfly; active module packages transmitters,receivers, transceivers and transponders using Chip on Board, Multi Chip Modules and Flip Chip Technology. |
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Wafer back lapping & wafer saw (up to 12 inch wafers), packaging assembly, system integration, electrical test, optical test and turnkey solutions. |
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In addition we can provide device characterizations and system level testing including all relevant optical and electrical key parameters and we meet all the requirements of Telcordia (Bellcore) standards for environmental and Material tests on components and sub systems. |
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