ELECTRONICS MANUFACTURING - PANTRONIX IC ASSEMBLY - Silicon Valley PCB Assembly - Silicon Valley PCB ASSEMBLY - Silicon Valley PHOTONICS - SILICON VALLEY  
IC ASSEMBLY - Pantronix Electronics Manufacturing - Pantronix IC Packaging - Pantronix PCB Assembly - Pantronix Silicon Valley - Pantronix  
PCB Assembly - Pantronix
IC ASSEMBLY, PANTRONIX, SILICON VALLEY PANTRONIX, SILICON VALLEY
ELECTRONICS MANUFACTURING, PANTRONIX, SILICON VALLEY PANTRONIX, SILICON VALLEY
IC PACKAGING - PANTRONIXSILICON VALLEY
 
 
 

Pantronix Corporation, located in the Silicon Valley, California has been a U.S. leader in Electronics Manufacturing, IC Assembly, IC Packaging, Contract Manufacturing, Custom Packaging & Testing, PCB Assembly services to global customers in a wide range of industries.

 
 
 
     
  Pantronix provides assembly services to companies which develop solar energy/solar power, renewable energy, concentrated photovoltaic (CPV) and photovoltaic solar cell technology.  
 
 
     
  Pantronix has been awarded a Certificate of Registration for Quality Management System to I.S. EN ISO 13485:2003. More...  
     
 
 
     
  PANTRONIX has been recognized once again for its commitment to a cleaner environment!!  We have received this award annually since the year 2000! More...  
     
   

Pantronix has invested in more equipment to provide even better service for our customers.
Pantronix now offers Back Lapping/Grinding for up to 12” wafers.  In addition we can saw up to 12” wafers (Si, SOS, Ceramic and Glass)  
 

 

Pantronix offers a large array of standard and customized semiconductor and photonic packaging.

     

Electronic Manufacturing Capability

  These include:    
  HERMETIC
  MULTI-CHIP MODULES (MCM)
  PLASTIC ENCAPSULATED (PDIP,PPGA,PLCC,SOIC,SSOP)
  PLASTIC QUAD FLAT PACK (PQFP,TQFP)
  BALL GRID ARRAY (BGA)
  QFN (QUAD FLAT NO LEADS)
  CUSTOM PACKAGES CURRENTLY AVAILABLE
  PHOTONIC PACKAGES
  ELECTRONIC MANUFACTURING
  WAFER CUTTING
  ELECTRICAL TEST CAPABILITIES
  RELIABILITY TEST CAPABILITIES (PLASTICS)
  RELIABILITY TEST-FIBER OPTICAL, TELCORDIA (BELL CORE) GR-63/1312/468-CORE
  RELIABILITY TEST CAPABILITIES (MIL-STD-883)
 
       
 
  • Hi-Rel & Custom Ceramic Packaging
  • Memory Modules
  • Optical Devices
  • Plastic Packaging
  • Photonic Packaging
   
    Pantronix's comprehensive array of services include complete turn-key, or build to print product solutions.      
    We can also offer:      
   
  • Custom Design
  • PCB Fabrication
  • PCB Assembly
  • Cabling
  • Enclosures
  • Testing
ISO 9001:2000 - PANTRONIX      
       
    Component Division Electronics Manufacturing Division
    Custom Packaging Design Services
    Hi-Rel Packaging Manufacturing & Testing
    Photonics Packaging Post Manufacturing Services
    Plastic Packaging  
     
 
PTX Profile | News | Webmaster | Sitemap | Links
   
 
2710 Lakeview Court, Fremont, California 94538
 
510-656-5898 | Fax: 510-656-7779
 
ptx@pantronix.com
 
© 2008 Pantronix. All Rights Reserved.

IC Assembly - Pantronix Electronics Manufacturing - Pantronix PCB Assembly - Pantronix Silicon Valley - Pantronix IC Packaging - Pantronix