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Pantronix
provides packaging, assembly, system integration, electrical and optical
testing for optical fiber communications, sensors, displays and other
applications. We are the leader in optoelectronic packaging, active
optical module assembly, and subsystem integration. Our mission is
to work with the state-of-the-art processes and methods to allow Pantronix
and our customers to create and maintain a competitive edge both technically
and economically in this field. |
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Our
services include: |
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- Device
Packages: PIN/APD, LED, Laser Diode with epoxy-free pigtailed
coaxial or butterfly packages with reliable single-mode fiber
alignments
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- Active
Component Module: Transmitters and receivers using chip-on-board,
multi-chip (MCM) and flip-chip technology to support high-speed
demands
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- Fiberoptic
subsystems: Provides various capabilities for engineering development
and full-production of passive optical module/assembly with fiber-array
to wave-guide packages
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- Device
and System-Level Tests: All relevant optical and electrical parameters
up to 10 GHz
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Pantronix
can meet all requirements of Telcordia (Bellcore) standards. We can
provide full capability to conduct environment tests, mechanical tests
and strict material tests on component and subsystem level. |
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