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Pantronix
Component Division provides a full range of cost effective custom
package solutions. Pantronix works closely with its customers to find
the optimum cost-performance package structure for their specific
applications. We offer various forms of multi-chip module (MCM) technologies,
multi-layer CQFP, hybrid packages, QFNs, and cavity packages. We offer
solutions for image sensors such as LCD sensors as well as bar-code
readers. Our cavity packages are designed for excellent performance
for wireless RF applications. If you have a circuitry requiring a
customized package, we have the solution at Pantronix. |
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