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HERMETIC  
MULTI-CHIP MODULES ( MCM )  
PLASTIC ENCAPSULATED (PDIP,PPGA,PLCC,SOIC,SSOP)  
PLASTIC QUAD FLAT PACK (PQFP, TQFP)  
BALL GRID ARRAY (BGA)  
QFN (Quad Flat No Leads)  
CUSTOM PACKAGES CURRENTLY AVAILABLE  
PHOTONIC PACKAGES  
ELECTRONIC MANUFACTURING  
WAFER CUTTING  
ELECTRICAL TEST CAPABILITIES  
RELIABILITY TEST CAPABILITIES (PLASTICS)  
RELIABILITY TEST- FIBER OPTICAL, TELCORDIA (Bell Core)
GR- 63/1312/468-CORE
 
RELIABILITY TEST CAPABILITIES (MIL-STD-883)  
 
     
PANTRONIX is a "Make it Happen" Organization Dedicated to Providing the Right Packaging Solution in any Situation!
 

PANTRONIX' Customers include industry leaders in the Aerospace, Military and Commercial Business Sectors - Domestic and Foreign.

(Selected names available upon request)

 

In addition to the capabilities listed herein, Pantronix is willing and able to explore the feasibility of other special packaging challenges. Call you Pantronix Account Representative or the Military Programs Director. 

 

           
  Component Division   Related Links   Electronics Manufacturing Division
  Custom Packaging   Cavitypack   Design Services
  Hi-Rel Packaging   Bonding Diagrams   Manufacturing & Testing
  Photonics Packaging   Package Outline Drawings   Post Manufacturing Services
  Plastic Packaging   BGA Table    
           
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