Home Profile Products & Services International Careers Contact	Item Family / Package Leads 1 CerDIP, .300" 8/14/16/18/20/24/28 2 CerDIP, .600" 22/24 3 CerDIP, .400" 24/28/32/40/48 4 Ceramic side / top / bottom brazed 8 thru 64 5 Chip carrier Up to 370 Leads 6 Chip On Board (COB), Chip On Flex(COF)   7 Metal can (Header) TO-3, -5, -8, -18, -39, -46, -52   8 Pin Grid Array (PGA), ceramic Up to 504 Pins 9 Cerpack, Cerquad All Pin Counts 10 Surface mount, ceramic (SMT)   11 Hybrid (Incl. Thick Film Print on Substrate)   12 Power devices (Up to .020" Alum Wire)   13 Microwave devices ( Various designs )

	PANTRONIX' CUSTOMERS INCLUDE INDUSTRY LEADERS IN THE AEROSPACE, MILITARY AND COMMERCIAL BUSINESS SECTORS - DOMESTIC AND FOREIGN (Selected names available upon request)
	IN ADDITION TO THE CAPABILITIES LISTED HEREIN, PANTRONIX IS WILLING AND ABLE TO EXPLORE THE FEASIBILITY OF OTHER SPECIALPACKAGING CHALLENGES. CALL YOUR PANTRONIX ACCOUNT REPRESENTATIVE OR THE MILITARY PROGRAMS DIRECTOR

	Component Division		Related Links		Electronics Manufacturing Division
	Custom Packaging		Cavitypack		Design Services
	Hi-Rel Packaging		Bonding Diagrams		Manufacturing & Testing
	Photonics Packaging		Package Outline Drawings		Post Manufacturing Services
	Plastic Packaging		BGA Table		Electronics Manufacturing Capability
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