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  HERMETIC
  MULTI-CHIP MODULES (MCM)
  PLASTIC ENCAPSULATED (PDIP, PPGA, PLCC, SOIC, SSOP)
  PLASTIC QUAD FLAT PACK (PQFP, TQFP)
  BALL GRID ARRAY (BGA)
  QFN (Quad Flat No Leads)
  CUSTOM PACKAGES CURRENTLY AVAILABLE
  PHOTONIC PACKAGES
  ELECTRONICS MANUFACTURING
  WAFER CUTTING
  ELECTRICAL TEST CAPABILITIES
  ELECTRICAL TEST CAPABILITIES (PLASTICS)
  RELIABILITY TEST-FIBER OPOTICAL, TELCORDIA (BELL CORE) GR-63/1312/468-CORE
  RELIABILITY TEST CAPABILITIES (MIL-STD-883)
   
   
  ISO9001:2008
  ISO13485:2003
   
  PANTRONIX is a "Make it Happen" organization dedicated to providing the right packaging solution in any situation.

 

 
     
   

PANTRONIX' CUSTOMERS INCLUDE INDUSTRY LEADERS IN THE AEROSPACE, MILITARY AND COMMERCIAL BUSINESS SECTORS - DOMESTIC AND FOREIGN

(Selected names available upon request)

     
    IN ADDITION TO THE CAPABILITIES LISTED HEREIN, PANTRONIX IS WILLING AND ABLE TO EXPLORE THE FEASIBILITY OF OTHER SPECIAL PACKAGING CHALLENGES. CALL YOUR PANTRONIX ACCOUNT REPRESENTATIVE OR THE MILITARY PROGRAMS DIRECTOR
     
         
  Component Division Electronics Manufacturing Division Related Links
  Custom Packaging Design Services BGA Table
  Hi-Rel Packaging Manufacturing & Testing CavityPack
  Photonics Packaging Post Manufacturing Services Package Availability
  Plastic Packaging Electronics Manufacturing Capability  
       
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