Custom Packages - Pantronix Corporation


	Component Division

	Custom Packaging

	Hi-Rel Packaging

	Photonics Packaging

	Plastic Packaging

	Electronics Manufacturing

	Design Service Capabilities

	Manufacturing & Testing

	Post Manufacturing Services

	Custom Packages Currently Available
	Pre-Molded Cavity Plastic Packages U.S. PAT. 5869883
		Package Options
	Economical option for image sensor & RF devices, optional	PDIP,PQFP,PLCC
	Glass or metal lid seals. JEDEC type configurations	TQFP,SOIC,SSOP
	Custom designs are available	PBGA & PPGA












		ISO9001:2008
		ISO13485:2003


	PANTRONIX is a "Make it Happen" organization dedicated to providing the right packaging solution in any situation.


		PANTRONIX' CUSTOMERS INCLUDE INDUSTRY LEADERS IN THE AEROSPACE, MILITARY AND COMMERCIAL BUSINESS SECTORS - DOMESTIC AND FOREIGN (Selected names available upon request)

		IN ADDITION TO THE CAPABILITIES LISTED HEREIN, PANTRONIX IS WILLING AND ABLE TO EXPLORE THE FEASIBILITY OF OTHER SPECIAL PACKAGING CHALLENGES. CALL YOUR PANTRONIX ACCOUNT REPRESENTATIVE OR THE MILITARY PROGRAMS DIRECTOR


Component Division	Electronics Manufacturing Division	Related Links
Custom Packaging	Design Services	BGA Table
Hi-Rel Packaging	Manufacturing & Testing	CavityPack
Photonics Packagin	Post Manufacturing Services	Package Availability
Plastic Packaging	Electronics Manufacturing Capability

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