electronics manufacturing - Pantronix ic packaging ic assembly
silicon valley BGA - Pantronix contract manufacturing
   
Home Profile Services News International Careers Contact
 
       
 
     
  Component Division  
     
  Custom Packaging  
     
  Hi-Rel Packaging  
     
  Photonics Packaging  
     
  Plastic Packaging  
     
  Electronics Manufacturing  
     
  Design Service Capabilities  
     
  Manufacturing & Testing  
     
  Post Manufacturing Services  
     
     
     
 
Item Package Size Ball Pitch
Plastic Ball Grid Array (PBGA)
14x22 mm
1.5, 1.27, 1.0, 0.76, 0.6 mm
25x23 mm
25x23 mm
27x27 mm
31x13 mm
35x35 mm
40x40 mm
 
5x5 to 19x19 mm
0.8, 0.65, 0.5 mm
 
Up to 45x45 mm
1.5, 1.27, 1.0, 0.76, 0.6 mm
 
Customer Defined

 

 
       
       
         
  Component Division Electronics Manufacturing Division Related Links
  Custom Packaging Design Services BGA Table
  Hi-Rel Packaging Manufacturing & Testing CavityPack
  Photonics Packaging Post Manufacturing Services Package Availability
  Plastic Packaging Electronics Manufacturing Capability  
       
• • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • • •
 
Home | Profile | News | International | Careers | Contact
 
© 2008 Pantronix Corporation. All Rights Reserved