Pantronix, since 1974 has been the U.S. leader in providing Advanced Packaging & Testing as well as Microelectronics Assembly to Global Customers in a wide range of industries.

Located in a 90,000 sq ft ISO 9001:2008 and ISO 13485:2003 Certified Facility in Fremont California.

Pantronix Corporation directly serves the Military, Aerospace, Medical, Communications, Computer and Consumer markets.

 

Pantronix Component Division

The Component Division provides a full range of Advanced Semiconductor and Photonic Device Packaging, Assembly and Testing Services.

Our Assembly Capabilities include Hi–Rel Packages, Multi -Chip Modules ( MCM ) Chip On Board ( COB ) Chip On Flex ( COF ) Custom Packages, Plastic Molded Packages, and Photonic Packages, Wire Bonding Services include, Aluminum Wedge, Gold Wedge, Gold Ball Wire Bonding. Custom Wire Bonding Solutions. Flip Chip capability. Our Test Services include Final Electrical Tests and various Reliability Tests. Facilities include Class 100, Class 10,000 clean rooms. Internal : Wafer Backlapping and Wafer Dicing capabilities ( up to 12 inch - 300 mm )

Pantronix Electronics Manufacturing Division

The Electronics Manufacturing Division provides full Turnkey Electronics Manufacturing Services to Original Equipment Manufactures ( OEM ).

We support design collaborations, complete Surface Mount Technology Manufacturing Services of board level assembly as well as System Integration, Final Testing and warranty services depending on the customer needs. Fully Automated SMT Lines. High Reliability leaded solder system for Medical and Military/Aerospace applications as well as RoHS optimized reflow ovens, and cleaning processes for water soluble "no clean" and RMA flux systems as well as specialized cleaning processes such as plasma, ultrasound etc. BGA, micro-BGA, Chip Scale pkg, Flip-Chip Handling. BGA rework station, Nicolet X-ray

 
    reach ITAR nsai 9001 2008 nsai 13485 2003